CPU-111-10
Intel Xeon Quad-Core 6U VPX SBC with 10Gig Ethernet Switch
The CPU-111-10 is a rugged, high-performance 6U VPX (VITA 46) Single Board Computer (SBC) featuring a quad-core Intel L5408 Xeon processor and integrated 10 Gigabit Ethernet switch to support full-mesh backplane data layer interconnectivity for up to eight SBCs integrated into a single chassis.
Available in air cooled or conduction cooled formats, the CPU-111-10 conforms to the OpenVPX (VITA 65) payload module profile MOD6-PAY-4F2T-12.2.2.4 with four fat pipes (10 GBase-BX4) and two thin pipes (1000Base-T).
Providing unparalleled data processing capabilities in a single-slot 6U VPX form factor card with built-in 10 Gigabit Ethernet fabric switching, the CPU-111-10 serves as an ideal open-architecture building-block for next-generation Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR) applications onboard (un)manned air / ground vehicles and shipboard platforms. Standard onboard I/O resources includes up to 8x 10 Gigabit Ethernet, 2x 1 Gigabit Ethernet, 4x SATA, 2x USB 2.0, 1x RS-232/485, and 1x VGA video ports. Dual XMC / PMC expansion module sites enable additional I/O expansion, including 10G XAUI lanes from each XMC card to the 10G switched fabric.
Offered in both convection cooled and ruggedized conduction cooled variants, the CPU-111-10 is designed for use with ANSI/VITA 46 1.0” pitch VPX form factor backplanes. Air cooled variants provides a front panel SFP+ port supporting CX4 copper and Fiber applications for chassis-to-chassis and rack-to-rack communications. Conduction cooled variants feature traditional board stiffeners, heat spreaders, and wedge locks to passively transfer heat to the chassis and tolerate high shock and vibration environments. An optional Rear Transition Module (RTM) is available that brings out VPX I/O over industry standard connectors.
An on-board, dual 10 Gigabit Ethernet controller, connected to the internal 10 Gigabit Ethernet Switch supports the IEEE 1588 Precision Time Protocol standard allowing all node boards to be synchronized in the sub-microsecond range.
OpenVPX Compatible
• Rugged Single-Slot 6U Single Board Computer compatible with VITA 65 OpenVPX Payload Module Profile MOD6-PAY-4F2T-12.2.2.4 (4x 10GBase-BX4 Fat Pipes and 2x 1000Base-T Thin Pipes)
High Performance x86 CPU
• 4-Core Intel Xeon L5408 Processor @ 2.13 GHz with 4GB of DDR2 RAM
• Linux, VxWorks, Windows, LynxOS, QNX, x86 RTOS Compatible
• 16 GB Bootable Solid State Flash Disk
10 Gigabit Switch
• Integrated 10 Gigabit Ethernet Packet Processor Provides Full-Mesh Data Layer Switch Fabric for Up to 8 SBCs without Use of Additional Switch Board (7 XAUI Ports to VPX Backplane, 1 SPF+ Port)
• 10 Gigabit XAUI Fabric Interfaces to Dual XMC Expansion Modules
• Front Panel SFP+ 10 Gigabit Port Supporting CX4 Copper and Fiber Applications for Chassis-to-Chassis and Rack-to-Rack Communications
I/O & Expansion
• Network: Up to 8x 10 Gigabit Ethernet, 2x 1 Gigabit Ethernet
• Peripherals: 4x SATA, 2x USB 2.0, 1x RS-232/485, and 1x VGA Video
• Dual XMC / PMC Mezzanine Expansion Sites
• Front Panel 10 Gigabit SFP+ and Optional USB Port (Air Cooled Version)
Rugged Design
• Designed to Meet MIL-STD-810 Environmental Conditions (Thermal, Shock, Vibration, Humidity, Altitude) and Stresses of VPX Chassis Injection/Ejection
• Air and Conduction Cooled Variants; Conductively Cooled Version Integrates Board Stiffener Heat Spreaders and Wedge Locks for High Shock and Vibration Immunity/Efficient Thermal Transfer
| Architecture: | • 6U OpenVPX (ANSI/VITA 65); Compatible Profile: MOD6-PAY-4F2T- 12.2.2.4 - Payload board w/ Four Fat Pipes (10 GBase-BX4), Two 1000Base-T Thin Pipes (Control Plane) |
| OS Support: | • Compatible with Linux, VxWorks, Windows, LynxOS, QNX, Other Popular x86 OS/Real Time Operating Systems (RTOS); Consult Factory for Available Drivers/BSPs |
| Processor: |
• Intel Xeon L5408 “Harpertown”, 2.13 GHz Clockspeed, Quad-Core, Quad-Thread • 12 MB L2 Cache (Shared), 32 KB L1 Cache per Core, 1066 MHz Front Side Bus, 64-bit Instruction Set, 45-nm • Support for Intel 64, Virtualization, SpeedStep Technology |
| Memory: |
• System RAM Memory: 4GB DDR2 SDRAM at 533/667 MHz (1066 MHz DDR) • Bootable Onboard Flash SSD: 8GB Solid-State Disk (Soldered NAND Flash) • Firmware Hub: 16Mbit SPI Flash |
| Chipsets: |
• Intel 5100 Memory Controller Hub (MCH) • Intel ICH9R I/O Controller Hub (ICH) • Silicon Motion SM750 Graphic Processor Unit (GPU), 2D Graphics Acceleration • PLX PEX8624 Gen 2 PCI Express Switch • Tsi384 PCI Express to PCI-X Bridge • Intel 82599EB (Niantic) Dual 10-Gigabit Ethernet Controller (with IEEE-1588 Precision Time Protocol Support for sub-microsecond synchronization between node boards) • Intel 82571EB Dual 1 Gigabit Ethernet Controller • NetLogic Puma AEL2005 10GigE PHY/SerDes for SFP+ 10GBASE-LRM Requirements |
| Ethernet Switch: |
• Fulcrum FM3224 10 Gigabit Ethernet Packet Processor for Layer 2 Switching • # Ports to VPX Backplane: up to 7x 10Gig Ethernet, 2x 1 Gigabit Ethernet • 1x Front Panel SFP+ Port Supporting 10 Gigabit Copper or Optical • Support for Full-Mesh Connectivity Between up to 8 CPU-111-10 SBCs • VITA 46.21 Full Mesh 10 Gigabit XAUI Interconnect for 5 Boards on Backplane per VITA 46.7 (Ethernet on VPX Fabric Connector) • Currently Unmanaged L2 Switch (Management Software Roadmapped – see below) |
| Switch Management: |
Future Roadmapped Layer 2 and/or Layer 2 + Layer 3 Switch Management Software: • Managed L2 Switch Protocol Support: STP, RTSP, MSTP, LACP, GVRP, IGMP, SNMP Ethernet MIB, Remote Software Update and Administration (CLI / Web Browser) • Managed L2/L3 Switch Protocol Support: Protocols Mentioned Above + RIP, RIPng, OSPFv2, OSPFv3, BGP, ISIS, VRRP, SNMP MIB |
| XMC/PMC: |
• 2x XMC / PMC Mezzanine Sites for Front / Rear Panel I/O Expansion • PMC/XMC I/O routing as defined by VITA 46.9 • XAUI Fat-Pipe Connectivity from XMC to 10 Gig Switch • Busses: 64bit / 133MHz PCI-X, x8 PCIe |
| Rear I/O Interfaces: |
• P0: VPX Utility Connectivity (per VITA 46.0) • P1: 4x 10Gig Ethernet (XAUI Fabric per VIA 46.21) • P2: XMC x12 Differential Pairs (per VITA 46.9), 1x 10Gig Ethernet XAUI from Switch • P3: PMC x64 Single Ended I/O (per VITA 46.9) • P4: 1x 10Gig Ethernet, 2x GigE Ethernet, 2x USB 2.0, 4x SATA 2.0, 1x RS-232/485, 1x VGA • P5: XMC x12 Differential Pairs (per VIA 46.9), 1x 10Gig Ethernet XAUI from Switch • P6: PMC x64 Single Ended I/O (per VITA 46.9) |
| Front Panel: | • 1x 10Gb Ethernet, SFP+ Copper or Optical; 1x Optional USB 2.0 Port (Air Cooled Version Only) |
| Physical: |
• Dimensions: 6U ANSI/VITA 46.0 VPX, Single-Slot, 1.0” Pitch • Weight: Approx. 3.0 lbs (<1350 grams) • Cooling: Conduction and Convection Cooling Options • Air Cooled Version: Includes Heatsinking and Aluminium Extraction Handles and Front Panel with Openings for Two PMC / XMC I/O • Conduction Cooled Version: Includes Heatspreaders,Wedge Locks, and Injector/Ejector Handles (no Front Panel I/O) |
| Power: |
• Power Input: +5 and +12 VDC • Power Consumption: 141W Typical (198 W Max); Lower Power Possible via CPU Throttling / Disabling of Unused 10 Gig Switch Ports |
| Environmental: |
Designed to Meet MIL-STD-810: • Operating Temperature: Standard Commercial and Extended Temperature Ranges • Storage Temperature: -40°C to +85°C • Operating Humidity: 0 to 95%, Non-Condensing • Storage Humidity: 0 to 100%, Non-Condensing • Altitude: Unlimited with Proper Thermal Management • Random Vibration: 0.1 g/2 Hz 15-2 kHz, 3 Axes, 1 Hour/Axis • Shock: 40 g Peak, 11ms, 3 pos/neg per Axis, 36 Terminal Peak Sawtooth Pulses |
| Reliability: | • MTBF Per MIL-HDBK-217F: TBD |
| Rear Transition Module: |
• Rear Transition Module (RTM) Available for Access to I/O Interfaces through Industry Standard Connectors, Eliminating Need for Custom Harnessing or Complex Cabling Fixtures • I/O Support for an SFP+ CX4 Copper/Fiber interface port, 4x external SATA (eSATA) ports, two USB ports, 2x Gigabit Ethernet ports, RS-232/485 console port, and VGA port |
| Options: |
• Conformal Coating • Custom RTM • CPU-111-10 Integrated into VPX Chassis |
• Rugged, High-Performance (Un)manned Vehicle / Aircraft Command and Control (C2) Platforms
• C4ISR Situational Awareness and Sensor Fusion; Civil / Military Mobile Rugged Computing
• Embedded Systems Technology Refresh
